: Samsung attacks at CeBIT !

Samsung unveils 4 new 2.5 and 3G phones on their booth: the SGH-Z400 is a 3G phone with a Video Out port, the D870 is a slim 2.5G phone, the SGH-Z550 is a slim 3G phone with 138MB of memory and the SGH-E900 is a 2.5G phone.

Hanover, Germany - 9 March 2006 – Samsung Electronics Co., Ltd. demonstrated its commitment for global mobile phone market, showcasing Samsung’s hero 3G and 2.5G handsets with the latest design and technology at CeBIT 2006.

With the technology achievements of the world’s first 3.6Mbps HSDPA technology demonstration at CES in January and the introduction of Europe’s HSDPA phone at 3GSM, Samsung further enhances its leadership in 3G market with its powerful 3G model, the SGH-Z400 and reinforces its leadership 2.5G mobile phone market with the world’s slimmest slider, the SGH-D870 at CeBIT 2006.

Kitae Lee, President of Telecommunication Network Business at Samsung, said, “Samsung’s latest handsets are designed with simplicity in mind. These mobile phones demonstrate our continuing investment in handset design and functionality and address the consumers’ need for desirable and high performing phones with elegant design. We believe that these powerful phones will set the trend for mobile phones this year and lead the 3G and 2.5G global mobile phone market. “